3d Tsv And 2.5d Market - Forecast 2021 - 2026
The Global 3D TSV and 2.5D market size is forecast to reach $154.8 billion by 2026, growing at a CAGR of 28.2% from 2021 to 2026. The semiconductor industry's packaging has been evolving at a rapid pace. As the number of semiconductor applications grows, the industry has been forced to rely on advancements in IC packaging due to a halt in CMOS scaling and rising prices. The only option that satisfies the performance requirements of applications such as AI, machine learning, and datacentres is to use 3D stacking technology. As a result, the 3D TSV and 2.5D market will be primarily driven by the rising demand for high-performance computing applications throughout the projected period. Furthermore, significant utilization of miniaturization in products in the consumer electronics sector including adoption of microelectromechanical systems in Integrated Circuits and semiconductor fabrication is garnering high investments from companies such as Intel Corp., Samsung, and others. The gro...